Email: info@xgcircuit.com
item |
Capability |
Layer |
1-30L |
Material |
FR-4,High frequency material(Ceramic、PTFE,Rogers,), Aluminum material,Polyimide (flexibe PCB and rigid-flex PCB) |
Board Thickness |
0.2-5.0mm |
Min trace width/space |
0.075mm/0.075mm |
Copper thickness |
1-6OZ |
Tolerance of hole position accuracy |
±0.05mm |
Aspect ratio |
16:1(hole size≥0.2mm) |
Min half hole size |
0.5mm |
Tolerance for trace width |
Trace width≥0.25mm,Tolerance ±10%; Trace width<0.25mm,Tolerance±0.025mm |
Soldermask color |
Green/Red/Yellow/Blue/Black/White color, etc |
Min S/M bridge |
0.1mm |
Min distance between carbon |
0.4mm |
Finish Process |
HASL,HALF FREE, ENIG, Flash Gold, Immersion Ag, Immersion Tin, OSP |
Selective Finish Process |
ENIG+OSP, ENIG+ Hard Gold, Full Plate Gold+ Hard Gold |
Routing Tolerance |
±0.1mm |
Board thickness range for PunchingPCB |
H/F material, B/T ≤0.6mm material with Halogen, B/T≤1.6mm |
Board Thickness Tolerance |
B/T≤1.0mm ±0.1mm; B/T>1.0mm Tolerance±10%
|
Max working panel |
620mm×730mm |
Impedance control |
≤100Ω tolerance ±10%; >100Ω tolerance±5% |
Shenzhen Xianggao Electronic Technology Co.,LTD
info@xgcircuit.com
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