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Capability

Layer 

1-30L

Material

FR-4,High frequency material(Ceramic、PTFE,Rogers,),

Aluminum material,Polyimide (flexibe PCB and rigid-flex PCB)

Board Thickness

0.2-5.0mm

Min trace width/space

0.075mm/0.075mm         

Copper thickness

1-6OZ

Tolerance of hole position accuracy

±0.05mm

Aspect ratio

16:1（hole size≥0.2mm)

Min half hole size

0.5mm

Tolerance for trace width

Trace width≥0.25mm，Tolerance ±10%；

Trace width<0.25mm，Tolerance±0.025mm

Soldermask color

Green/Red/Yellow/Blue/Black/White color, etc

Min S/M bridge

0.1mm

Min distance between carbon

0.4mm

Finish Process 

HASL,HALF FREE, ENIG, Flash Gold,

Immersion Ag, Immersion Tin, OSP

Selective Finish Process

ENIG+OSP, ENIG+ Hard Gold,

Full Plate Gold+ Hard Gold

Routing Tolerance

±0.1mm

Board thickness range for PunchingPCB

H/F material, B/T ≤0.6mm 

material with Halogen, B/T≤1.6mm

Board Thickness Tolerance 

B/T≤1.0mm ±0.1mm；

B/T>1.0mm  Tolerance±10%

Max working panel
size

620mm×730mm

Impedance control
tolerance

≤100Ω  tolerance ±10%； >100Ω  tolerance±5%